It has isotropic properties and low warpage.

它各向同性性能和低翘曲。

It has improved impact resistance and low warpage.

它改善了耐冲击性和低翘曲。

Next, inspect the gusset for warpage and straighten as needed.

下一步，检查和整顿的翘曲扣板根据需要的一面。

Adjusting delay time and gas pressure can reduce the warpage of the part.

工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。

Thickening the wall will help reduce orientation related warpage problems.

增加壁厚将有助于减少因取向引起的翘曲问题。

The speckle projection correlation technique is used to measure the chip warpage.

本文采用投影散斑相关法对芯片翘曲度进行了测量。

A warpage analysis provides answers to questions such as: will the moulding distort?

变形分析可以对我们的难题进行解决，如：这个产品是否存在扭曲变形？

It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.

它改进表面美观，良好的尺寸稳定性和低翘曲的特点。

Moreover, fast filling and less time for holding were also dedicated to reduce the warpage of product…

适当提高注射速率和减少保压时间也可减小制品翘曲。

An even cooling design becomes very important to control the shrinkage and warpage at an acceptable level.

为了将收缩弯翘控制在可以接受的程度，均衡的冷却设计变得非常重要。

According to the statistical results, the injection time is the most important affecting factor on warpage.

结果表明，注射时间对注塑件翘曲变形的影响最大。

The impact of temperature dependent material property on the warpage of composite shell segment was discussed.

研究了温度敏感性对复合材料开口圆柱层压壳热翘曲变形影响。

Base on the nonlinear large analysis, warpage of matrix SDBGA during the whole assembly processes are predicted.

文中基于非线性特性分析、预测了在整个集成工艺中SDBGA阵列的翘曲。

All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.

所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。

The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.

分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。

The causes producing warpage and the effecting rules of various factors were found out and the solving methods put forward.

找到了产生翘曲变形的原因及影响规律，提出了解决的方法。

Summary:The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.

分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。

If this causes a warpage problem, it sometimes helps to raise the overall water temperature and slow the rate of heat transfer.

如果这样还有翘曲问题，那么升高总的水温并降低热交换速度是有益的。

It produces moldings with good surface finish, is resistant to chemicals and stress cracking, and has low shrinkage and warpage.

它生产的模具表面光洁度好，可耐化学品和应力开裂，并具有低收缩和翘曲。

Sim? ilarly, an increase in case depth, particularly uneven case depth in case hardening steels, increases warpage on quenching.

与此类似，渗碳层厚度越大，特别是对于渗碳层厚度不一的渗碳用钢，淬火时更易产生翘曲。

It includes checking the first and last parts in a job run for signs of warpage, flashing, mold wear, and other process maladies.

这个手册包括检查我们做的第一个直到最后一个部件，以发现下述问题的迹象：翘曲、飞边、模具磨损和其它的工艺缺陷。

Changing the wall thickness can have a profound effect on the warpage, depending on the part geometry and the material being molded.

根据零件特征和填充的材料，零件壁厚对翘曲有很重大的影响。

Basically smooth and shiny on the surface, have no obvious fault of contraction dent, brindle, warpage, defective bubble and plastify.

表面基本上平滑光亮，无明显收缩凹痕，斑纹，翘曲，气泡及塑化不良等缺陷。

Thus, the semi-insulating nitride semiconductor crystal substrate in which warpage is less and cracking is less likely can be obtained.

由此，能获得其中翘曲较少且较不可能发生破裂的半绝缘氮化物半导体晶体衬底。

A numerical study of residual stresses and warpage was undertaken according to the characteristics of plastic injection molding process.

针对塑料注射成型工艺的特点，提出了残余应力和翘曲变形的数值模拟方法。

Series of glass fiber reinforced PET with low warpage have been prepared according to the mechanism and different methods of reduction of warpage.

依据降低翘曲的机理，选用不同降低翘曲的方法，制备了系列低翘曲玻纤增强PET复合材料。

Therefore, analyzing the warpage of the plastic parts and optimizing their process parameters, is a very effective measure to improve the production quality.

因此对塑件的翘曲变形进行分析并对其注塑工艺参数进行优化，是提高生产质量的一个非常有效的措施。

For applications requiring lower warpage and less anisotropy, choose a grade that incorporates both inorganic filler and glass fiber, such as E6810 or E6807LHF.

对于各向异性适用于需要低翘曲少，选择一个牌号，既包含无机填料和玻璃纤维e6807lhf，如E6810或。

Based on the experimental phenomena, the effects of various processing parameters on the warpage were summarized, and the mechanism of warpage was also discussed.

归纳实验现象，总结各种因素对翘曲变形的影响规律，并探讨翘曲变形成型机理。