UV lithography, silicon etching and soft lithography were adopted to fabricate micropillar arrayed cell culture substrates.

以紫外光光刻、硅蚀刻及软光刻技术制备了微柱阵列型细胞培养基底。

A process of soft lithography was introduced for fabrication of PDMS (polydimethylsiloxane) micro-mixer on micro-fluidic chip.

介绍了一种用软光刻技术制作微流芯片上PDMS微混合器的工艺。

Firstly the poly(dimethylsiloxane) (PDMS) elastomeric stamp used in soft lithography was fabricated by the photolithography technique.

本文还用微印刷技术证实了聚电解质多层膜的可压缩性。

A sheet molded with hundreds of perforations, from 10 to 100 microns across, can be manufactured using soft lithography and set down on another surface.

他们可以利用软微影术制造一片东西，上面戳有数百个直径10 ~ 100微米的小孔，然后将之覆盖在另一表面上。

As a newly coming micro fabrication technology, soft lithography use elastomeric stamp to replace hard stamp in traditional lithography to fabricate micro patterns and structures.

作为一种新型的微图形复制技术，软光刻技术用弹性模替代传统光刻技术中使用的硬模来产生微形状和微结构。

The WMOC ROM a low-index and transparent silicon rubber as the cladding layer material, and takes the advantage of soft lithography method to copy information to its surface at the same time.

采用折射率高的薄波片作为芯层材料、折射率低的透明硅橡胶作为包层材料，利用软刻印方法将信息复制在硅橡胶表面，制作出10层光卡。

The process of SU-8 photoresist lithography is researched, and the influence of steps like coating and soft-bake on the lithography is studied.

初步研究了SU-8胶的光刻工艺流程，讨论了涂胶、前烘等各个步骤对光刻结果的影响。

Processes of SU-8 photoresist mold and polymer elastomeric stamp were researched in order to solve the technology of the key part—elastomeric stamp in the soft-lithography.

为了解决软光刻技术中核心元件弹性印章的制备技术，对SU-8胶印模和聚合物弹性印章进行了工艺研究。

Some polymer materials are used as substrate. Kinds of new microfabrication technology are presented, including lithography, soft etching, LIGA, DEM and bonding, etc.

系统介绍了芯片实验室的各种制备技术，这些技术包括紫外光刻、软刻蚀、LIGA技术、DEM技术、键合等。

Using high - power pulsed laser - produced plasma as soft X - ray source for approach lithography is described in this paper.

描述了用高功率脉冲激光打靶产生的等离子体作为软x射线源而进行的接近式软x射线光刻研究。