双列直插式引线框架

Dual in line lead frame

集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。

Gold, silver and nickel plating of IC lead frame and package shell.

KFC合金是具有代表性的高导电引线框架材料之一.

KFC copper alloy is one of the representative lead frame materials with good electric conductivity.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

采用第一注塑模具和绝缘胶对所述芯片基座和引线框架实施注塑；

Performing injection molding on the chip base and the lead frame by using a first injection mould and insulation adhesive;

由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件，所以对其软化温度提出了很高的要求。

The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation .