Experimental study of laser milling of silicon wafer.

单晶硅的激光铣削试验研究。

The new device is a silicon wafer about the shape and size of a playing card.

这个新设备是一张纸牌大小的硅晶片。

Using silicon wafer as substrate makes compatibility with IC technology possible.

使用硅片作为衬底使得与IC工艺的兼容成为可能。

By the halfwidth of rocking curve we can estimate the bending stress of silicon wafer.

从双晶衍射半峰宽值可以评估硅片的抗弯强度。

Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.

太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。

The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.

研究金刚石砂轮磨削单晶硅片时的表面磨削温度。

Another is a ceramic dielectric waveguide covered by a silicon wafer with high resistivity.

另一种是用高阻硅薄片覆盖在陶瓷介质波导上组成的。

The corporation, built in 1966, is one of the biggest silicon wafer manufactures in China now.

公司始建于1966年，是中国目前最大的硅半导体材料生产基地之一。

To make its artificial leaf, the MIT team spread its catalysts on opposite sides of a silicon wafer.

此研究团队将催化剂涂在了硅片的正反两面，使它像一片人工叶子。

Test wafer - a silicon wafer that is used in manufacturing for monitoring and testing purposes.

测试晶圆片駦-用于生产中监测和测试的晶圆片。

The invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.

本发明公开了一种具有穿导孔的硅晶片及其制造方法。

The microscope comprises a silicon wafer filter membrane which is highly- planar and does not fluoresce.

该显微镜包含 高度平坦和不发荧光的硅晶片过滤膜。

A disruption in silicon wafer production can then stall makers of memory chips and, ultimately, consumer products.

硅晶片生产的中断会使内存芯片的生产停顿，并最终会影响到消费产品。

The process begins with a four-inch silicon wafer. A coating of metal is added and sputtered across the wafer.

该过程刚开始是利用一个四英寸的硅晶片，然后在其表面溅射一层金属涂层。

The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically.

对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。

Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.

制造集成电路需要将如半导体和金属等多层材料放置在硅片上。

With the application of larger diameter silicon wafer, high precision grinding is widely used for its manufacturing.

随着大直径硅片的应用，硅片的超精密磨削得到广泛的应用。

A quantitative mechanism of particle removal from silicon wafer surfaces by wet chemical cleaning process was proposed.

对化学法清洗硅片过程中消除颗粒的机理作了定量的探讨。

In experiment, a series of silicon nitride thin films are prepared on cleaned silicon wafer by varying deposition parameters.

本实验通过系统地改变沉积参数，在经过清洗好的单晶硅片上沉积了一系列的氮化硅薄膜。

The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.

该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。

Base silicon layer - the silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.

底部硅层ꢃ-在绝缘层下部的晶圆片，是顶部硅层的基础。

Indeed, the silicon wafer itself is cut from a large rod of silicon, which is grown from a single crystal, and so is itself a single crystal.

实际上，硅片本身是从一根大的硅棒上切片下来，硅棒由单晶生长而成，所以芯片本身也是一种单晶。

This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.

加速度计用普通的N型硅片制造，为了刻蚀高深宽比的结构，使用了深反应离子刻蚀（DRIE）工艺。

Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.

介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。

This article introduces the clean process of RCA for silicon wafer, and the design and apply in the manufacture of this kind of silicon wafer auto clean equipment.

主要介绍了半导体晶圆rca清洗工艺以及半导体晶圆自动清洗设备在生产中的结构设计和应用情况。

Water for electronic industry use: the wash water of electronic components such as: integrate circuit silicon wafer display tube electrode tube and circuitry tube etc.

电子工业用水：集成电路、硅晶片、显示管、电极管、电路管等电子元件冲洗水。

The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication.

现有技术中传声器的背侧孔典型地要求在制造过程中于硅片的后表面上进行一种二次机加工操作。

Water for electronic industry use: the wash water of electronic components, such as: integrate circuit, silicon wafer, display tube, electrode tube, and circuitry tube, etc.

电子工业用水：集成电路、硅晶片、显示管、电极管、电路管等电子元件冲洗水。

The Suntech researchers developed a way to chemically treat the silicon wafer in narrow bands.These treated areas attract silver, which forms metal lines just 20 micrometers wide.

尚德的研究人员研发了一种化学方法，在窄带中处理硅片，该区域能吸收银，形成宽约20微米的金属线。

The Suntech researchers developed a way to chemically treat the silicon wafer in narrow bands. These treated areas attract silver, which forms metal lines just 20 micrometers wide.

尚德的研究人员研发了一种化学方法，在窄带中处理硅片，该区域能吸收银，形成宽约20微米的金属线。