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1 词典释义:
gold plating
时间: 2025-09-29 20:31:25
英 [ɡəʊld ˈpleɪtɪŋ]
美 [ɡoʊld ˈpleɪdɪŋ]

镀金;镀金工艺;电镀金

双语例句
  • The gold plating liquid may contain water.

    该镀金液可以包含水。

  • For protecting PCB in the process of gold plating.

    适用于镀金过程中保护印刷电路板。

  • A low cyanide bright 22k gold plating process was investigated.

    研究了一种低氰电镀光亮22 K金工艺。

  • Silvering and gold plating is a traditional decoration technology.

    错金银是中国传统装饰工艺之一。

  • Is the tape test performed to make sure the adhesion of gold plating?

    是否用胶带测试确保镀金的附着力?

  • Ensure that developers aren't "gold plating" (adding features beyond the requirements).

    确保开发人员不会“镀金”(增加超出需求的特性)。

  • The plating material cna be substituted for gold plating and silver plating to become...

    该镀层材料可代替镀金和镀银,成为良好的弱电接点材料。

  • The process of wear was from adhesive to abrasive, the gold plating was worn out at last.

    磨损过程为先粘结再擦伤,最后镀金层被磨穿。

  • Timeboxes serve as the perfect hedge against perfectionism, gold plating and procrastination.

    时间盒可以很好地防止完美主义、画蛇添足和拖延。

  • Porosity is one of the important factors to evaluate the quality of gold plating on connectors.

    微孔率是评价连接器镀金质量的重要参数之一。

  • Two dangling stars, one in Silver Shade crystal and the other in gold plating, add extra sparkle.

    分别垂挂着银色魅影水晶星星和镀金色星星。

  • Consequently neutral nickel, bright copper, bright nickel and decorative gold plating were applied.

    随后电镀中性镍、光亮铜、光亮镍及镀金。

  • All too often, projects undergo the "gold plating" process long after deadlines and success conditions are determined.

    很多时候,项目经历了“镀金”的过程,期限已经过期很久,成功条件得以明确。

  • Watch gold plating is generally used stainless steel plating techniques, so it has rarely been found in this case.

    现在钟表镀金普遍采用不锈钢电镀技巧,因此已经很少发现这种情形了。

  • The Oscar statuettes, officially dubbed the Academy Award of Merit, have a 24-karat gold plating on their surface.

    被正式称为学院奖的奥斯卡小雕像,表面镀有一层24k的黄金。

  • Some aspects that need to be deeply studied on electroless gold plating for engineering plastics were put forward.

    提出了对塑料表面镀金工艺还需深入研究的几个方面。

  • The present paper deals with the bath for hard gold plating, the quantity controll and the wear mechanism of coatings as well.

    简要论述了电子工业中接插件硬金镀层的耐磨机理,获得硬金镀层的镀液,节金代金以及镀金层的质量检测等问题。

  • The technology not only can be applied to the gold plating of all kinds of printed circuit board, but also can be used to pro…

    可用于各式印刷线路板镀金,并可作为电子产品的自催化化学镀厚金前的顶覆金层。

  • Pierced earrings with 3 interlinking rings in rhodium, gold and rose-gold plating; 2 rings set with Golden Shadow and clear crystals.

    穿耳环3环相连,在铑,黄金和玫瑰金镀;2环一套金色的影子清晰晶体。

  • This habit is about finding the balance between doing enough error handling and not doing so much gold plating that your code is never finished.

    这一习惯要求您编写足够的错误处理代码,而不是编写对付所有错误的代码,以致代码迟迟不能完成。

  • Existing growing device has shortcomings that gold plating is not convenient, plating layer is not uniform, and crystal growth has great stress.

    现有的生长装置存在镀金不方便、镀层不均匀、晶体生长应力大等弊端。

  • We provide the service of polishing, cleaning, gold plating and white plating etc, Customers can take your old jewelry to our store and fresh it new.

    本店提供抛光,清洗,镀黄、白金等服务,客人可以将自己的旧首饰带来本店翻新,使您的旧首饰焕然一新。

  • At the same time, we should think of the factors and natural conditions of use, function and corrosion mechanism and anticorrosive problem of gold plating.

    同时,还应该考虑金镀层表面的使用条件、使用环境、功能和腐蚀机理及抗腐蚀性保护等具体问题。

  • The process formula of acid bright copper plating, acid bright nickel plating, (silver) plating and various colour gold plating on fresh flowers were presented.

    并给出了鲜花上酸性光亮镀铜、酸性光亮镀镍、镀银以及镀各种彩色金的工艺配方。

  • Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.

    在标准CMOS工艺基础上,应用无电浸镀金改进传感电极的生物兼容性,并采用特殊封装技术提高芯片在溶液环境中的稳定性。

  • Our Gold plating Division is specialized in the connectors or pin's plating for mobile phones, PC, digital cameras, cars, etc. The metal piece could be copper or s.

    本公司镀金分厂主要从事手机、电脑、数码相机、汽车等设备的电子接插件及连接件的功能性电镀。

  • The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.

    此工艺含有能够减缓镀金初始时沉积速率,又能降低对镍层腐蚀的添加剂。

  • After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).

    研究了甲基异丁基酮(MIBK)萃取分离金,用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。

近义词
镀金